Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit

dc.contributor.author	Kohler, Tobias
dc.date.accessioned	2023-07-19T06:19:35Z
dc.date.available	2023-07-19T06:19:35Z
dc.date.issued	2023
dc.date.submitted	2023-07-03T13:45:36Z
dc.identifier	https://library.oapen.org/handle/20.500.12657/63731
dc.identifier.uri	https://directory.doabooks.org/handle/20.500.12854/101549
dc.description.abstract	The adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
dc.language	German
dc.rights	open access
dc.subject.other	Vergussmasse; Scherfestigkeit; Primer; Alkoxysilan; Leistungselektronik; Potting Material; Shear Strength; Alkoxysilane; Power Electronics
dc.subject.other	thema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials
dc.title	Entwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
dc.type	book
oapen.identifier.doi	10.5445/KSP/1000156532
oapen.relation.isPublishedBy	68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2
oapen.pages	220

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