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dc.contributor.authorKohler, Tobias
dc.date.accessioned2025-03-07T21:43:33Z
dc.date.available2025-03-07T21:43:33Z
dc.date.issued2023
dc.date.submitted2023-07-03T13:45:36Z
dc.identifierhttps://library.oapen.org/handle/20.500.12657/63731
dc.identifier.urihttps://doab-dev.siscern.org/handle/20.500.12854/167960
dc.description.abstractThe adhesion of encapsulation materials is an dendrimental factor for the robustness and functionality of a power electronic device. In this work the adhesion of ceramic potting materials was developed. A new primer was invented, that enabled high shear strengths even at high temperatures for short times. Furthermore, a completely new potting material was invented on the basis of alkoxysilanes. Especially MTES showed beneficial properties for the adhesion under temperature load.
dc.languageGerman
dc.rightsopen access
dc.subject.classificationthema EDItEUR::T Technology, Engineering, Agriculture, Industrial processes::TG Mechanical engineering and materials
dc.subject.otherVergussmasse; Scherfestigkeit; Primer; Alkoxysilan; Leistungselektronik; Potting Material; Shear Strength; Alkoxysilane; Power Electronics
dc.titleEntwicklung keramischer Vergussmassen mit Alkoxysilanen zur Steigerung der Haftfestigkeit
dc.typebook
oapen.identifier.doi10.5445/KSP/1000156532
oapen.relation.isPublishedBy68fffc18-8f7b-44fa-ac7e-0b7d7d979bd2
oapen.relation.isbn9783731512882
oapen.collectionAG Universitätsverlage
oapen.pages220
peerreview.review.typeFull text
peerreview.anonymityAll identities known
peerreview.reviewer.typeInternal editor
peerreview.reviewer.typeExternal peer reviewer
peerreview.review.stagePre-publication
peerreview.open.reviewNo
peerreview.publish.responsibilityScientific or Editorial Board
peerreview.id8ad5c235-9810-49eb-b358-27c8675324d9
peerreview.titleDissertations (Dissertationen)


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